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% Author       : 焱铭
% Date         : 2023-07-04 20:56:59 +0800
% LastEditTime : 2023-07-05 13:41:22 +0800
% FilePath     : \SCI-LaTeX-Submission-Process-for-Elsevier\2-Manuscript-EN\Section\Section1.tex
% Description  : 
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\section{Introduction}
\gl{当前现状}

随着第五代移动通信等技术的发展\cite{Lau_2022}，推动了射频技术向高速、小型化和多功能方向的快速发展，电子芯片的热通量也在增加。
\Nomenclature
芯片产生的高温和芯片附近较大的温度梯度会降低集成电路的功耗。